Part 2: COMVEC 2023 – A Gateway to New Opportunities

Previously, in Part 1, I discussed the background of COMVEC, why participation in industry events is paramount, introduced my fellow panelists, and discussed our preparation for our panel discussion. Now, it’s time for the main event!

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During the panel discussion at COMVEC 2023, I primarily focused on leading the discussions on MIL/SIL and HIL processes. Drawing from my background and hands-on involvement in MIL/HIL test developments, I shared my perspectives on ideas and practices related to MIL/SIL/HIL testing.

A significant portion of my team’s knowledge was rooted in the Model-In-the-Loop (MIL) and Hardware-In-the-Loop (HIL) testing. These methodologies are pivotal in system validation and testing. I elaborated on test automation and the essential role of continuous integration in the modern engineering landscape.

Several months prior to COMVEC 2023, during our weekly retro meetings, my DISTek team had compiled a document detailing the strategies, definitions, and processes associated with MIL and HIL testing. This document captured the invaluable lessons we had collected along the way.

This groundwork significantly paid off during the panel discussion. When faced with queries from the audience, I was equipped, not just with textbook answers, but with real-world stories, experiences, and solutions.


COMVEC 2023 kicked off with a captivating keynote address on sustainability, setting the tone for the event. Throughout the conference, I had the opportunity to attend panel discussions on various technical tracks. During the coffee breaks, I had the pleasure of connecting with fellow professionals, industry experts, and attendees.

As a panelist, the experience went beyond the stage, offering a chance to engage in one-on-one discussions with attendees who sought additional insights. The diverse perspectives shared during these conversations highlighted the collaborative spirit of the event.

At the DISTek sales booth in the display area, time was well spent engaging in meaningful discussions with booth visitors. Additionally, I had the chance to connect with professionals from other companies. The event provided a platform for in-depth technical conversations, particularly with representatives from booths focused on simulation and Hardware-in-the-Loop (HIL) setups in the product development cycle.


COMVEC 2023 not only served as a forum for sharing knowledge but also as a hub for building a stronger professional network. Looking back, the opportunity to participate in COMVEC 2023 as a panelist was both professionally rewarding, and a gateway to new opportunities.